Tungsten copper communication structural parts 3

Power next-gen communication systems with CNC-machined tungsten-copper (W-Cu) alloy components, engineered for extreme thermal management, high-frequency stability, and unmatched durability in mission-critical environments.
Why Tungsten-Copper?
Ultra-High Thermal Conductivity (180-200 W/mK): Efficiently dissipates heat in high-power RF/microwave devices, laser diodes, and 5G base stations.
Low Thermal Expansion (6-8 ppm/°C): Matches ceramic/glass substrates, ensuring hermetic sealing and reliability in thermal cycling.
EMI/RFI Shielding: Superior electromagnetic interference protection for satellite communication and radar systems.
High Arc Resistance: Withstands electrical arcing in high-voltage switches and aerospace-grade connectors.
Capabilities:
±0.02mm Precision: Complex geometries for waveguide flanges, RF housings, and laser collimators.
Material Expertise: Optimized machining of W70Cu30 to W90Cu10 alloys for balanced thermal/electrical performance.
Surface Finishing: Mirror polishing (Ra ≤0.2µm), nickel/gold plating, or oxidation-resistant coatings.
Applications:
5G/6G Infrastructure: Power amplifier housings, antenna mounts.
Aerospace & Defense: Radar T/R modules, missile guidance systems.
Semiconductor: High-power LED heat sinks, vacuum electron devices.
Quality Assurance:
ASTM B702 compliance, full density inspection (X-ray, ultrasonic).
ISO 9001-certified processes with CMM validation.
From prototype to production – delivering components that thrive under thermal and electrical extremes.