Semiconductor power device housing 1

Empower high-efficiency, high-reliability power electronics with precision-engineered semiconductor packaging housings. Designed to meet the rigorous demands of thermal management, electrical insulation, and structural integrity, our CNC-machined solutions ensure optimal performance for IGBTs, MOSFETs, SiC, and GaN modules in extreme operating conditions.
Key Challenges Addressed:
Thermal Runaway Prevention: High thermal conductivity (up to 380 W/mK) materials like copper, AlSiC, and direct-bonded copper (DBC) substrates for rapid heat dissipation.
CTE Matching: Minimize thermal stress with tailored alloys (e.g., Cu-Mo, Cu-W) to align with semiconductor chips (Si: ~4 ppm/°C; GaN: ~5.6 ppm/°C).
EMI/RFI Shielding: Integrated Faraday cage designs and conductive coatings to suppress electromagnetic interference.
High-Voltage Isolation: Precision-machined ceramic (AlN, Al₂O₃) or polymer insulators for breakdown voltages exceeding 10 kV.
Capabilities:
Ultra-Precision Machining: ±0.01mm tolerances for microchannel cooling plates, lead frames, and hermetic sealing surfaces.
Advanced Materials Expertise:
Metal-Ceramic Hybrids: Kovar-to-alumina brazing for vacuum-sealed modules.
Lightweight Solutions: Aluminum graphite composites for EV power inverters.
Surface Engineering: Anti-corrosion coatings (Ni/Au plating, Alodine), laser marking, and solderable finishes.
Full Process Integration: From DBC substrate patterning to final housing assembly and leak testing (He mass spectrometry).
Applications:
EV/HEV Systems: Motor controllers, onboard chargers, and battery management housings.
Renewable Energy: Solar inverters, wind turbine converters.
Industrial Drives: High-frequency UPS, welding equipment, and robotics.
5G Infrastructure: RF power amplifier packages and base station thermal modules.
Quality & Compliance:
AEC-Q101 (automotive) and MIL-STD-883 (defense) standards.
3D CT scanning for void detection, thermal cycling tests (-55°C to 175°C), and HIPOT validation.
Scalable Solutions:
Prototype to high-volume production wit