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Optical Detection and Communication 4

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Optical Detection and Communication 4

Precision CNC Machining for Optical Inspection & Communication Series

Power cutting-edge optical and communication technologies with CNC-machined components engineered for micron-level accuracy, thermal stability, and signal integrity. From laser systems to 5G infrastructure, our solutions ensure seamless performance in high-precision, high-reliability applications.
Key Advantages:
Sub-Micron Tolerances (±0.005mm): Critical for optical alignment, lens mounts, and fiber-optic connectors in LiDAR, photonics, and quantum communication.
Material Versatility:
Aluminum Alloys (6061, 7075): Lightweight, high thermal conductivity for laser housings and heat sinks.
Stainless Steel (316L): Corrosion-resistant RF shielding enclosures and sensor mounts.
Kovar/Invar: Near-zero thermal expansion for hermetic sealing in optical transceivers.
Engineering Plastics (PEEK, PC): Electrical insulation and vibration damping for IoT modules.
EMI/RFI Shielding: Integrated designs for signal purity in 5G mmWave devices and satellite communication.
Core Applications:
Optical Inspection Systems:
Precision stages for interferometry, spectrometers, and automated optical inspection (AOI) equipment.
Kinematic mounts, beam splitter housings, and collimator bases.
Communication Hardware:
5G/6G antenna arrays, waveguide flanges, and RF filter housings.
Fiber-optic alignment sleeves, laser diode packages, and TOSA/ROSA components.
Advanced Capabilities:
Nano-Surface Finishing (Ra ≤0.1µm): Minimize light scattering in optical interfaces.
Microchannel Cooling: CNC-machined thermal management for high-power laser diodes.
Hybrid Metal-Ceramic Bonding: Kovar-to-ceramic brazing for vacuum-sealed modules.
Quality Assurance:
Compliance with ISO 10110 (optical standards) and Telcordia GR-468 (communication reliability).
Full-spectrum metrology: CMM, white-light interferometry, and thermal cycling tests (-40°C to 120°C).
Prototype to Production – Precision Engineered for Light and Data.